Optimizing Grinding Efficiency through Torque Analysis with SKF

Opportunity overview

Grinding is a widely used chip removal process for machining workpieces at high speeds to accurate dimensions and surface texture. However, the efficiency of the grinding process depends on various factors, such as the force applied to the abrasive grain and the contact area. The chip removal will also require energy to overcome the material's friction and shearing, which can be monitored as torque or power drawn from the grinding spindle. There are opportunities to further optimize the grinding process to increase efficiency.

Currently, touch detection methods are used, but they have limitations and can result in waste of time and energy. For example, without touch detection, about 15-20% of the grinding cycle is wasted before contact. Even with power-based touch sensing, which is only suitable for certain grinding operations, the waste can be reduced by only about 60%. Similarly, intermittent contact between the workpiece and the grinding wheel due to workpiece distortion or imperfect roundness also poses challenges in optimizing the grinding process. To continue optimizing the grinding process, SKF is now looking for solutions that extract more accurate information from the sensor installed in the machines, such as acoustic emission and power from the spindle drives.

Summary of requested solution

A way to measure and analyze the torque would enable SKF to further optimize the grinding process while in operation. This solution involves measuring the torque on the spindle head and analyzing the shaft position data to correct any uneven grinding process. The grinding process can be optimized for each ring by measuring the torque, resulting in reduced scrap loss and rework, increased overall equipment efficiency, higher speed and output, and reduced production costs and energy use. Although a similar solution exists for magnetic spindles, this approach is needed for the thousands of mechanical spindles used for grinding.